![]() The main purpose of the heat preservation section is to stabilize the temperature of each element in the SMA and minimize the temperature difference. The heat preservation section of the reflow oven refers to the area where the temperature rises from the melting point of the solder paste from 120☌ to 150☌. Temperature setting method of reflow oven insulation section: The typical temperature rise rate is 2☌/S.Ģ. However, the ascent rate is usually set to 1~3☌/S. To prevent thermal shock from damaging the components. Due to the faster heating rate, the temperature difference in the latter section of the SMA is larger. The solvent volatilization is insufficient, which affects the welding quality. If it is too fast, the thermal shock will occur, and the circuit board and components may be damaged and too slow. The purpose of this area is to heat the PCB at room temperature as soon as possible to achieve the second specific goal, but the heating rate must be controlled within an appropriate range. Temperature setting method of reflow oven preheating section: The reflow oven temperature setting is to set the reflow oven temperature curve.ġ. This is very useful for obtaining the best solderability, avoiding damage to components due to over-temperature, and ensuring soldering quality. The temperature curve provides an intuitive method to analyze the temperature change of a component during the entire reflow soldering process. ![]() The reflow oven temperature curve refers to the curve of the temperature of a certain point on the SMA with time when the SMA passes through the reflow oven furnace.
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